By Dr. Craig Baehr | Intercom Executive Editor
Our July/August 2023 issue focuses on Soft Skills in Technical Communication with important lessons learned and practical takeaways that apply to a wide range of industries, projects, and teams. Specific topics covered in this issue include using empathy in conflict resolution, recognition and intention in virtual teams, using negotiation and diplomacy skills, and demonstrating reliability in the workplace. Our other columns and features this month include topics on career advancement, writing product features and benefits, and all about STC’s Technical Communication Body of Knowledge (TCBOK) project. Whether you’re looking to hone your soft skills, learn how to put your best foot forward on a new team, or take on the responsibility of managing others, this issue should provide you with some best practices to help out.
At this year’s Summit, I had the opportunity to co-present with my counterpart, Dr. Miriam Williams, editor of our flagship journal Technical Communication at a session entitled “Meet the Editors.” Our session provided an overview of both Intercom and Technical Communication along with a detailed look at our production process, schedule, and a sneak peak at upcoming issue topics. You can find details about upcoming Intercom featured topics at https://www.stc.org/intercom/editorial-calendar/ to learn more about the scope of forthcoming issues.
If you’re interested in writing for Intercom, as always, we would love to hear from you. Recently, we’ve updated our Author Guidelines page on the STC website, so whether you’re writing an article, column, or feature, be sure to check them out at https://www.stc.org/intercom/author-guidelines/ for information on preparing your manuscript. In the guidelines, you’ll find details on everything you need to know, including writing abstracts, formatting, using graphics, citation styles, writing short biographies, permissions, and our contact information. Following these guidelines closely, including The Chicago Manual of Style, will ensure your submission is ready for editorial review by our staff. When you’re ready to submit your manuscript, simply email it to us at intercom-editor@stc.org along with any questions about the submission process or guidelines.
